Estudos da corrosão anisotrópica do silício frente soluções de KOH e sais metálicos. / Monocristalin silicon anisotropic etching study in KOH solution with metallic salts.

AUTOR(ES)
DATA DE PUBLICAÇÃO

2008

RESUMO

In the past few years it has been a huge evolution in industrial area of MEMS, and this one is characterized by the development of the processes of microelectronic to reduce cost and to integrate different systems that become very trustful in different applications. It is being done a work in silicon anisotropic etching in Potassium hydroxide (KOH) added with metallic impurities aiming the study of the kinetic compensation effect and the influence of these metals in the anisotropy and in etch rates. It was analyzed the effects of Zinc, Aluminum and Cupper and it could be observed changes in etch rates, and, consequently, in the resulting geometries. After characterization of theses changes it was proved that previous suppositions that the kinetic compensation effects found in direct synthesis of dimethyldichorosilane (DMDCS) and silicon would also occur for silicon anisotropic etching in KOH, due to both reactions follows Arrhenius law and are anisotropic reactions. The obtained results proved the theory suppositions that the etch rate and anisotropy can be modified when adding metals to the solution.

ASSUNTO(S)

processos de microeletrônica koh anisotropic isokinetic silicon

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