Oxidation Behavior of Copper at a Temperature below 300 °C and the Methodology for Passivation

In this study, we investigate the oxidation behavior of copper at temperatures below 300 °C and its mechanism. A methodology to slow down the oxidation rate is then proposed based on the observed mechanism. The oxides formed after oxidation at low temperatures have fine crystal sizes; the rate constants reach 2×10-15 m2/s and 6×10-14 m2/s at 200 °C and 300 °C, respectively. A passivation treatment at 600 °C in nitrogen produces a thin oxide layer composed of relatively large Cu2O crystals. The presence of such a layer slows down the oxidation rate constants by an order of magnitude. This...