Electrodeposition of nickel plates on copper substrates using PC y PRC

Electrodeposition processes using direct current (DC) require the use of additives to control deposit structure and properties as well as current distribution. The Pulse Current (PC) and Pulse Reverse Current (PRC) techniques improve the properties of deposits based on an appropriate selection of the parameters involved. This research evaluates the influence of cathodic time (t on), anodic time (t rev), relaxation time (t off), and voltage on the resistance to corrosion of nickel deposits using the PC and PRC techniques. Test were conducted in a dynamic manner, employing a rotating system with...