Determination of Microstructure, Mechanical, Electrical and Thermal Properties of The Directionally Solidified Al-Si-Co Ternary Alloy

In this work, Al-12.6Si-2Co (wt.%) ternary alloy of near eutectic composition was directionally solidified at a constant temperature gradient (G=7.60 K/mm) in a wide range of growth rates (V=8.35-166.30 µm/s) using by Bridgman type growth apparatus. Flake spacing (λ), microhardness (HV), tensile stress (σ) and electrical resistivity (ρ) were measured from directionally solidified samples. The dependence of flake spacing, microhardness, tensile stress and electrical resistivity on growth rate (V) was also determined by statistical analysis. According to these results, it has been found that...