Analysis of Ball Soldering Parameters on the Properties of a BGA Packaged Semiconductor

Integrated circuits have several applications, including medicine and the aerospace industry, where reliability is essential. Packaging is an important step in the manufacturing of integrated circuits, and ball soldering is one of the most critical process, especially in assembling and interconnecting integrated circuits. The solder joint formed during the ball soldering process is intrinsically associated with the performance and the reliability of the electronic system. This study analyzed the influence of parameters or factors affecting the ball soldering process from the perspective of int...