Resfriamento por convecção natural de placas de circuito impresso formando um canal vertical

AUTOR(ES)
DATA DE PUBLICAÇÃO

1997

RESUMO

Experiments and theoretical modeling were carried out on the cooling by natural convection of an array of vertical parallel printed circuit boards. The thermal analysis of printed circuit boards (PCB) for predicting, as accurately as possible, the temperature of each component is important to obtain an optimal thermal design and to check the performance of an existing PCB. Experiments were performed with power resistors simulating real components; each PCB comprises 25 resistors arranged in 4 rows of 4 elements and 3 staggered rows of 3 elements. Thermocouples were applied to the epoxy and to the resistors. The temperature of the air between the boards was also measured by means of thermocouples placed in the channel. Due to its relatively small thickness, the temperature gradient across the epoxy board was neglected. The heat diffusion equation in two-dimensional Cartesian coordinates under steady state conditions was solved numerically for the epoxy board. Mass flow rate in the channel and natural convection heat transfer coefficients for the epoxy board were calculated by natural convection correlations for an array of vertical parallel plates. The concept of "buoyancy induced forced convection" was applied to the resistors where forced convection heat transfer coefficients were employed. Resistors were linked to the epoxy board by thermal resistances and the problem was solved iterativelly. The main objective of the work is to present a simple theoretical model for determining the temperature field on the printed circuit board. Good agreement between this theoretical model and the experimenta results was observed

ASSUNTO(S)

analise termica calor - transmissão calor - convecção resfriamento calor - transferencia circuitos impressos

ACESSO AO ARTIGO

Documentos Relacionados