Modification of stearic acid in Ar and Ar-O2 pulsed DC discharge

AUTOR(ES)

Bernardelli, Euclides Alexandre, Souza, Thiago, Mafra, Márcio, Maliska, Ana Maria, Belmonte, Thierry, Klein, Aloisio Nelmo

FONTE

Materials Research

DATA DE PUBLICAÇÃO

14/10/2011

RESUMO

Stearic acid (CH3(CH2)16COOH) was treated with Ar and Ar-O2 (10%) pulsed DC discharges created by a cathode-anode confined system to elucidate the role of oxygen in plasma cleaning. The treatment time (5 to 120 minutes) and plasma gas mixture (Ar and Ar-O2) were varied, and the results showed that the mass variation of stearic acid after Ar-O2 plasma exposure was greater than that of pure Ar plasma treatment. Thus, compared to Ar*, active oxygen species (O and O2, in all states) enhance the etching process, regardless of their concentration. During the treatments, a liquid phase developed at the melting temperature of stearic acid, and differential thermal analyses showed that the formation of a liquid phase was associated with the breakage of bonds due to treatment with an Ar or Ar-O2 plasma. After treatment with Ar and Ar-O2 plasmas, the sample surface was significantly modified, especially when Ar-O2 was utilized. The role of oxygen in the treatment process is to break carbonaceous chains by forming oxidized products and/or to act as a barrier again ramification, which accelerates the etching of stearic acid.

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