Electrodeposition Study of Ni Coatings on Copper from Choline Chloride-Based Deep Eutectic Solvents
AUTOR(ES)
Urcezino, Amanda S. C., Santos, Luis P. M. dos, Casciano, Paulo N. S., Correia, Adriana N., Lima-Neto, Pedro de
FONTE
J. Braz. Chem. Soc.
DATA DE PUBLICAÇÃO
2017-07
RESUMO
Nickel was electrodeposited from choline chloride (ChCl)-based deep eutectic solvents (DESs) containing ethylene glycol (EG) and urea (U) on Cu substrate. The influence of the temperature and of DESs nature was evaluated. The diffusion coefficients of nickel varied from 2.2 × 10-9 to 3.7 × 10-8 cm2 s-1 for ChCl:2U and from 1.3 × 10-8 to 5.8 × 10-8 cm2 s-1 for ChCl:2EG with increasing temperature. The nucleation process of Ni on Cu at 70 °C was determined as instantaneous in ChCl:2EG and progressive in ChCl:2U using Scharifker and Hills model. The SEM characterization showed that with increasing temperature, more compact coatings were obtained. Linear polarization and electrochemical impedance spectroscopy were used to evaluate the corrosion performance of the obtained deposits in 3.5% NaCl. The coatings were more protective as higher the temperature of deposition, with polarization resistance (Rp) values from 3.53 to 19.11 kΩ cm2.
Documentos Relacionados
- Determination of the maximum inhibitory dilution of cetylpyridinium chloride-based mouthwashes against staphylococcus aureus: an in vitro study
- DEEP EUTECTIC SOLVENTS BASED ON BETAINE AND PROPYLENE GLYCOL AS POTENTIAL DENITRIFICATION AGENTS: A LIQUID-LIQUID EQUILIBRIUM STUDY
- A Choline Chloride-Ethylene Glycol Deep Eutectic Solvent Based on Magnetic Polydopamine with Preconcentration and Determination for Sulfonylurea Herbicides in Water Samples
- Astaxanthin Recovery from Shrimp Residue by Solvent Ethanol Extraction Using Choline Chloride:Glycerol Deep Eutectic Solvent as Adjuvant
- Evaluation of intestinal protozoan morphology in polyvinyl alcohol preservative: comparison of zinc sulfate- and mercuric chloride-based compounds for use in Schaudinn's fixative.