Crescimento de InGaP sobre GaAs por epitaxia de feixe quimico

AUTOR(ES)
DATA DE PUBLICAÇÃO

2003

RESUMO

In this work we present a study on residual and intentional dopant elements, on ordering and on interfaces of InGaP lattice matched with GaAs. The goal of this study is to obtain semiconductor devices using this material. We have found that Carbon is the main residual dopant. It is incorporated as donor and as acceptor, the ratio between these two incorporation modes depends on the growth temperature. For intentional silicon doping, it was found that, at low growth temperatures and Si concentration lower than 4,0 x10 18 cm -3 , silicon incorporation as donor is proportional to the Si vapour pressure in the Si effusion cell temperature. For higher growth temperatures, Si-donor concentration increases and there is an improvement on crystal quality. For intentional Beryllium doping, it was found that, at high growth temperatures and Be concentration lower than 3,0 x10 18 cm -3 , beryllium as acceptor incorporation is proportional to the Be vapour pressure in the Be effusion cell. For lower growth temperatures, Be-acceptor concentration increases and there is an improvement on crystal quality. In Si as well as in Be dopage, the data analysis indicates the complex formation of Si-C and Be-P, respectively . In the usual growth temperature range (500oC - 560oC) we have also verified that the ordering increases as the temperature increases and it is almost insensitive to the III/V ratio. For higher growth temperatures, we have found a relationship between surface structures and ordered regions. In growing InGaP/GaAs/InGaP quantum wells, we have found an InGaAsP layer formation at the interface InGaP/GaAs. We were able to minimize this layer and improve the interface quality. Finally, we could show the application of our study in some semiconductor devices

ASSUNTO(S)

arsenieto de galio semicondutores epitaxia

ACESSO AO ARTIGO

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