Avaliação da influência do choque térmico na aderência dos revestimentos de argamassa. / Evaluation of thermal shocks influence on bonding of external mortar renderings.
AUTOR(ES)
Juan Francisco Temoche Esquivel
DATA DE PUBLICAÇÃO
2009
RESUMO
The present study focus on thermal variation effects on mortar rendering bonding degradation. Among the variety of factors that condition the bonding of mortar renderings, a critic scenario can be defined by the existence of interface macro-flaws between mortar rendering and substrate, and by the thermal variation intensity in the extreme situation of thermal shock. This research aims to experimentally evaluate the effects of continuous thermal shock cycles on the bonding strength of mortar renderings in two macro-flaw rate extreme situations in the contact surface between mortar rendering and substrate for two types of mortar. A parametric model based on finite element analysis has been developed to support the experimental work, which allowed ascertaining temperature profile as well as stress and strain distribution in the mortar rendering by changing the macro-flaws rate and mortar rendering properties. As a result, one could define the variables with higher influence and test panel geometry, as well as the boundary conditions to be used in the experimental program. The experimental program has been performed first in pilot scale and then in a definite stage, which required designing and building of equipment for the execution and control of cyclic thermal shock laboratory tests. Furthermore, bond strength tests have been performed on the mortar rendering samples, and effects of variables have been analyzed by using statistical help. Results have shown that the existence of interfacial macro-flaws decreases bond strength values between mortar rendering and substrate, and this scenario worsens under thermal shock. Mortar renderings with higher Youngs modulus (E) are more affected.
ASSUNTO(S)
thermal shock revestimentos de fachadas argamassa interfacial macroflaws mortar renderings thermal stresses bond strength
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