Analise da transferencia de calor em equipamentos de transmissão digital com as placas de circuito impresso arranjadas horizontalmente

AUTOR(ES)
DATA DE PUBLICAÇÃO

1985

RESUMO

Printed circuit boards may be arranged horizontally in many situations, as for example in some digital transmission equipments being used in Brazil. Such pieces of equipment, known as slim racks, have a high aspect ratio height/width and are assembled side by side and back to back. The present work deals with the steady - state thermal dissipation in the so-called thermal unit of the slim rack ma de of the printed circuit board, the magnetic shield above it and the bounding walls, constituting an enclosure. The heat transfer in each thermal unit was investigated by assuming isothermal enclosure surfaces with uniform radiosities. Once the thermal paths from where the energy is being -generated to where it is dissipated are identified, the electric circuit analogy is employed to obtain the thermal resistance network. Most of the thermal resistancesare temperature-dependent and the associated nonlinear algebraic equations system can be solved only by an iterative method. An experimental investigation was carried out in a module of the slim rack with. simplified boundary conditions in order to verify the theoretical model. The agreement between the theoretical and experimental temperature field was found to be good

ASSUNTO(S)

calor - transmissão circuito impresso

ACESSO AO ARTIGO

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